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国外专利

FLOOR HEATING STRUCTURE | Floor-heating structure

  2014/11/19   浏览:571

[导读] Structure for floor-heating, has under-floor ground, floor-heating panel having heat source, and flooring material, and elastic adhesive agent having specific softening property applied in real junction portion

公开号 JP2006046028A
优先权号 JP2004232426A
优先权日 2004-08-09
申请号 JP2004232426A
申请日期 2004-08-09
公开日期 2006-02-16
IPC - 现版 E04F001518 | F24D000314 | F24D000316 | F24D001302
IPC - 现版 - DWPI E04F001518 | F24D001302 | F24D000314 | F24D000316
专利权人/申请人 EIDAI CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor heating structure capable of preventing formation of a large clearance in a joint part of flooring materials to be laid. SOLUTION: In this floor heating structure provided with at least a floor base 20, a floor heating panel 30 arranged on it and having a heat source, and the flooring material 10 arranged on it, the long flooring material 10 is constituted by assembling a plurality of small pieces 11 in the longitudinal direction by rabbet joining, and temperature-dependent elastic adhesive 14 which is hard at normal temperature, but is softened at temperatures generated in floor heating is applied to the rabbet joining part. COPYRIGHT: (C)2006,JPO&NCIPI SUBJECT of the Invention Floor-heating structure WHEREIN: It prevents that big gap is formed at the junction part of a flooring material to lay over. PROBLEM to be solved Floor-heating structure equipped with the under-floor ground 20, the floor-heating panel 30 which has the heat source arranged on it, and the flooring material 10 arranged on it at least WHEREIN: Several small-piece piece 11 is assembled by real joining to a longitudinal direction, and the long-type flooring material 10 is comprised, Although it is a room-temperature-setting type|mold, the elastic adhesive agent 14 with the temperature dependency softened at the temperature generate|occur|produced at the time of floor heating is applied to this real junction part. SELECTED DRAWINGS FIG. 3 [MAT_IMAGE 000002]
摘要 - DWPI The floor-heating structure has floor-heating panel (30) having heat source, and flooring material (10) sequentially arranged on under-floor ground (20). Flooring material is long shaped material formed by assembling several small materials (11) by real joining along longitudinal direction. Elastic adhesive agent (14) which softens at the temperature generated during floor heating, is applied in real junction portion. For floor heating. The floor-heating structure has capability of maintaining improved external appearance of heating floor surface. Formation of gap at junction portion of floor material is prevented. Preferred Adhesive: The elastic adhesive agent is vinyl acetate type adhesive, hot-melt type adhesive or silicone type adhesive. The figure shows the sectional drawing of the floor-heating structure.10flooring material11small material14elastic adhesive agent20under-floor ground30floor-heating panel31base material
发明人 YAMAMOTO YOSHINARI | SAITO MASATOSHI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2004
DWPI 同族专利成员 JP2006046028A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200615
DWPI 同族专利国家/地区计数 1

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