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FLOOR HEATING PANEL | The panel for floor heating

  2014/11/19   浏览:693

[导读] Floor heating panel maintains non-electroconductive space corresponding to crate at heat insulation layer on undersurface of planar-heating-sheet, while laminating plywood to upper face of planar-heating-sheet

公开号 JP2003130377A
优先权号 JP2001331409A
优先权日 2001-10-29
申请号 JP2001331409A
申请日期 2001-10-29
公开日期 2003-05-08
IPC - 现版 E04F001518 | F24D001302
IPC - 现版 - DWPI F24D001302 | E04F001518
专利权人/申请人 HIGASHIDA MOTOAKI | HIGASHIDA YOSHIHIRO | TOEI KOGYO KK
摘要 (英语) PROBLEM TO BE SOLVED: To improve the workability of execution of a heated floor, and prevent damage to an insulator just under a nailing point when a floor heating panel or flooring is nailed on a floor bed. SOLUTION: The floor heating panel has a structure wherein a wooden board 50 and a wooden board 20 are layered respectively on an upper surface and a lower surface of a surface heating body sheet 40 wherein heating elements and electrodes are printed in a plurality of portions on a film-shaped insulating board 41 to form surface heating bodies 42. The plywood 20 is layered on the lower surface of the surface heating body sheet 40 via an insulator layer 32. The insulator layer 32 has wood frames 31 of plywood as nailable parts, and the surface heating body sheet 40 has nonconductive spaces in areas corresponding to the wood frames 31 of the insulator layer 32 as nailable parts. The veneer 50 is layered on the upper surface of the surface heating body sheet 40. The surface of the veneer 50 indicates areas 51 as nailable portions corresponding to the wood frames 31. COPYRIGHT: (C)2003,JPO&Japio SUBJECT of the Invention Workability|operativity at the time of construction of a heating floor is raised, and damage on the heat insulating material of the nailing directly under part when striking a nail and using the panel for floor heating or a flooring material as a flooring is prevented. PROBLEM to be solved It is the panel for floor heating which laminated|stacked the wood board|plate material 50 and the wood board|plate material 20 on the upper surface and lower surface of the planar-heating-element sheet|seat 40 which printed the heater element and the electrode on several [ on the insulated substrate 41 of a film-form ], and formed the planar heating element 42, Comprising: While laminating|stacking the wood composite board 20 through the heat insulating material layer 32 on the lower surface of the planar-heating-element sheet|seat 40, crate 31 which is a nailing possible part wood made of plywood is provided at the heat insulating material layer 32. A nonelectroconductive space is provided at the range which respond|corresponds to crate 31 which is the nailing possible part of the heat insulating material layer 32 at the planar-heating-element sheet|seat 40. While laminating|stacking plywood 50 on the upper surface of the planar-heating-element sheet|seat 40, range 51 which is the nailing possible part which respond|corresponds to crate 31 was displayed on the surface of this plywood 50. [MAT_IMAGE 000002]
摘要 - DWPI A non-electroconductive space is maintained corresponding to crate (31) at the heat insulation layer (32) on the underface of the planar-heating-sheet (40), while laminating plywood (50) to the upper face of planar-heating-sheet. For floor heating. Simplifies the construction method of floor heating panel. Prevents slack occurrence and thereby prevents the floor creaking noise. Prevents short circuiting by providing non-conduction material space corresponding to crate at planar-heating-sheet. The figure shows the top and sectional views of floor heating panel structure. (Drawing includes non-English language text).31crate32heat insulation layer40planar-heating-sheet50plywood
发明人 HIGASHIDA MOTOAKI | HIGASHIDA YOSHIHIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2001
DWPI 同族专利成员 JP2003130377A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200339
DWPI 同族专利国家/地区计数 1

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