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国外专利

WOOD FLOOR MATERIAL FOR HOT WATER TYPE FLOOR HEATING FLOOR | The wooden flooring for warm water type floor-heating floors

  2014/11/19   浏览:651

[导读] Wood flooring for warm water-type floor-heating floor, has first base material which is a wooden material using phenol-resin type adhesive agent

公开号 JP2002061855A
优先权号 JP2000251247A
优先权日 2000-08-22
申请号 JP2000251247A
申请日期 2000-08-22
公开日期 2002-02-28
IPC - 现版 B27M000300 | B27M000304 | E04F001504 | E04F001518 | F24D000316
IPC - 现版 - DWPI F24D000316 | B27M000300 | B27M000304 | E04F001504 | E04F001518
专利权人/申请人 EIDAI CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a wood material for a hot water type underfloor heating floor capable of widely suppressing a radiation amount of free formaldehyde from a floor material. SOLUTION: In a wood floor material 10 for a hot water type floor heating floor having a base material part 5 and a surface decoration layer 8, the base material part 5 is formed such that a first base material 1, a metallic foil 3, and a thin second base material 3 are adhered together for lamination. At least the first base material 1 is a wood material where a phenol resin adhesive is used as an adhesive. COPYRIGHT: (C)2002,JPO&Japio SUBJECT of the Invention The wooden flooring for warm water type floor-heating floors which can suppress the diffusion amount of free formaldehyde from a flooring largely is obtained. PROBLEM to be solved In the wooden flooring 10 for warm water type floor-heating floors provided with the base-material part 5 and the surface decoration layer 8, the 1st base material 1 and the metal foil 3, and the thin 2nd base material 3 are laminated by bonding, and the base-material part 5 is formed. Let at least the above-mentioned 1st base material 1 be the wooden material which used phenol resin adhesive as an adhesive agent. [MAT_IMAGE 000002]
摘要 - DWPI The wood flooring (10) has a base member (5) and a surface decorative layer (8). The base member is formed by laminating and bonding a first base material (1), an aluminium foil (2), and a thin second base material (3). At least the first base material is a wooden material using the phenol-resin type adhesive agent as an adhesive agent. For warm water-type floor-heating floor. Suppresses amount of diffusion of free formaldehyde from flooring. The figures include a perspective view and a b-b line sectional view showing the wood flooring.1First base material2Aluminium foil3Second base material5Base member8Surface decorative layer10Wood flooring
发明人 INOUE TAKAO | YAMADA KAZUHIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2000
DWPI 同族专利成员 JP2002061855A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200233
DWPI 同族专利国家/地区计数 1

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