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国外专利

FLOOR HEATING STRUCTURE | Floor-heating structure

  2014/11/19   浏览:671

[导读] Floor heating structure has grooves for placing warm water flow pipes, provided in heat insulating material of floor panel mounted on floor base

公开号 JP2001323648A
优先权号 JP2000147556A
优先权日 2000-05-19
申请号 JP2000147556A
申请日期 2000-05-19
公开日期 2001-11-22
IPC - 现版 E04F001518 | E04F001500 | F24D000316
IPC - 现版 - DWPI E04F001518 | E04F001500 | F24D000316
专利权人/申请人 BRIDGESTONE CORP
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor heating structure sharply improving thermal efficiency, reducing the number of part items, and capable of improving substrate installation, i.e., workability and many functions by floor heating installation. SOLUTION: Floor substrate panels 2 are spread on a floor foundation bed 10 such as a concrete slab via support legs 1, finishing lumbers 3 are provided on the floor substrate panels 2, and hot water pipes 4 are arranged between the finishing lumbers 3 and the floor substrate panels 2 in this floor heating structure. Each floor substrate panel 2 is integrally laminated with plates 21, 22 and a heat insulating member 23, and grooves 6 for arranging the hot water pipes 4 are provided on the layer of the heating insulating member 23 of the floor substrate panel 2. COPYRIGHT: (C)2001,JPO&Japio SUBJECT of the Invention Extensive improvement of a thermal efficiency is aimed at, and a member score is reduced and it enables it to achieve the workability improvement and many-skilled-worker-izing by foundation|substrate construction, i.e., floor-heating construction. PROBLEM to be solved The floor-heating structure which put the subfloor panel 2 in order via the supporting leg 1 on the floor|bed base|substrate 10, such as a concrete slab, provided the finishing material 3 on these subfloor panel 2, and arrange|positioned the warm water pipe 4 between the finishing material 3 and the subfloor panel 2 WHEREIN: The subfloor panel 2 carried out lamination integration of the board|plate materials 21 and 22 and the heat insulating material 23, and provided the groove|channel 6 for arrangement|positioning of the warm water pipe 4 on the layer of the heat insulating material 23 of this subfloor panel 2. [MAT_IMAGE 000002]
摘要 - DWPI A set of grooves for positioning several warm water flow pipes (4) are provided in a heat insulating layer (23) of a floor panel (2). The floor panel is located on a floor base (10) such as concrete slab through a set of support legs (1). The warm water flow pipes are located below a floor finishing layer (3). For heating of floor. Increases thermal efficiency by locating warm water flow pipes over the insulating material and thereby preventing downward transmittance of heat. Avoids complicated construction by mounting the floor panels over the support legs. The figure shows a sectional view of the floor panel.2Floor panel3Floor finishing layer4Water flow pipes10Floor base23Heat insulating layer
发明人 INABA KENJI | TSUKADA SUSUMU | YAMANAKA MASANAO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2000
DWPI 同族专利成员 JP2001323648A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200210
DWPI 同族专利国家/地区计数 1

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