收藏本站设为首页联系我们
首页 > 专利介绍 > 国外专利 > FLOOR HEATING EXECUTION STRUCTURE | Floor-heating construction structure

国外专利

FLOOR HEATING EXECUTION STRUCTURE | Floor-heating construction structure

  2014/11/19   浏览:598

[导读] Floor heating construction structure for spreading floor board used in floor heating, has resin material coupled to floor boards through seams for providing floor heating to panel foundation material

公开号 JP2001182296A
优先权号 JP1999373107A
优先权日 1999-12-28
申请号 JP1999373107A
申请日期 1999-12-28
公开日期 2001-07-03
IPC - 现版 E04F001502 | F24D001902
IPC - 现版 - DWPI E04F001502 | F24D001902
专利权人/申请人 MATSUSHITA ELECTRIC WORKS LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor heating execution structure to prevent the increase of the joint space of floor plates for floor heating by providing panel substrates which are unshrinkable even during the floor heating operation. SOLUTION: In the floor heating execution structure 1 in which the floor plates 2 for floor heating are installed over the panel substrates 4, a resin material 5 is provided on the panel substrates 4, and the resin material 5 is located at the joints 3 of the floor plates 2 for floor heating. COPYRIGHT: (C)2001,JPO&Japio SUBJECT of the Invention The panel base sheet which is not shrink|contracted at the time of a floor-heating driving|operation is provided, and the floor-heating construction structure where the gap of the joint|seam of the floor board for floor heating does not become large is provided. PROBLEM to be solved The floor-heating construction structure which spreads|paves the floor board 2 for floor heating on the panel base sheet 4 WHEREIN: The resin material 5 is provided in the panel base sheet 4, and it was made for the resin material 5 to come to the joint|seam 3 of the floor board 2 for floor heating. The floor-heating construction structure 1 characterized by the above-mentioned. [MAT_IMAGE 000002]
摘要 - DWPI The floor heating construction structure (1) has a resin material (5) coupled to the floor boards (2) through seams (3) for providing floor heating to the panel foundation material (4). The floor boards are spread for floor heating on the panel foundation material. For spreading floor board used in floor heating over foundation material. Restrains disconnection of seams of floor board during floor heating. Ensures efficient production of panel foundation materials with improved dimensional stability. The figure is a block diagram showing the floor heating construction structure.1Floor heating construction structure2Floor boards3Seams4Panel foundation material5Resin material
发明人 NAKAGAWA MASAHIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1999
DWPI 同族专利成员 JP2001182296A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200153
DWPI 同族专利国家/地区计数 1

联系我们

服务热线:010-62889437
传真:010-62889437
邮箱:ham2003@caf.ac.cn
地址:北京市海淀区香山路中国林业科学研究院木材工业研究所

关于我们联盟章程会员风采联系我们

CopyAllRight © 2014  版权所有: 木地板专利联盟  京ICP备07017635号