收藏本站设为首页联系我们
首页 > 专利介绍 > 国外专利 > WOODY COMPOSITE PLATE AND ITS MANUFACTURE | A wooden composite board and its manufacturing method

国外专利

WOODY COMPOSITE PLATE AND ITS MANUFACTURE | A wooden composite board and its manufacturing method

  2014/11/19   浏览:623

[导读] Wooden composite board used as floor material for floor heating

公开号 JP2000102903A
优先权号 JP1998273260A
优先权日 1998-09-28
申请号 JP1998273260A
申请日期 1998-09-28
公开日期 2000-04-11
IPC - 现版 B27D000104 | B27N000304 | B32B002102 | E04C000210
IPC - 现版 - DWPI B27D000104 | B27N000304 | B32B002102 | E04C000210
专利权人/申请人 EIDAI CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To eliminate an obstruction of a surface smoothness caused by cutout, a bulge or the like of a low manufacturing cost by a laminating thin intermediate density fiber plates obtained by slicing a flitch made by laminating a plurality of intermediate density fiber plates with an adhesive in a specific thickness from a slicer or the like on one or both surfaces. SOLUTION: A flitch obtained by coating a plurality of cut intermediate density fiber plates therebetween with a one-liquid type moisture curing type urethane resin, and pressing the plates to integrate the plates is sequentially sliced to 0.3 to 1.0 mm in a horizontal direction to obtain thin intermediate density fiber plates 1a. The plates 1a are laminated on a surface of a woody base material 2 of a plywood through an adhesive layer 3. As the adhesive, an aqueous vinyl urethane adhesive, an aqueous formalin adhesive or the like is used. Since the plate 1a is thin to sufficiently impregnate therein with the adhesive to improve its strength, even if an initial impregnation of the adhesive is insufficient, the sufficient impregnation can be achieved at this time point. Thus, the plate 1a suppresses a surface deformation such as a cutoff, a bulge or the like intrinsic for the plate 1a and hence reduces its cost. COPYRIGHT: (C)2000,JPO&Japio SUBJECT of the Invention It has a middle density fibre board in a surface layer, and it is intrinsic|native to a middle density fibre board, and the wooden composite board which suppressed surface changes, such as やふくれ, is manufactured at low cost. PROBLEM to be solved A plurality of middle density fibre board 1 is laminated by bonding using an adhesive agent, and the flitch 10 is manufactured, This flitch 10 is sliced in thickness of 0.3 mm - about 1.0 mm with a slicer etc., and the thin middle density fibre board 1a is obtained, It is laminated by bonding to the wooden base material 2. [MAT_IMAGE 000002]
摘要 - DWPI The adhesion lamination of two or more sheets of thin middle density fiber board (1a) is performed on one side or both sides of a wooden base material (2) using predetermined amount of adhesive. Each middle density fiber board is sliced by a slicer into a predetermined thickness ranging from 0.3mm to 1.0mm. An INDEPENDENT CLAIM is also included for a wooden composite board manufacturing method. Used as floor material for floor heating. For use in adhesion lamination of ornamental surface layer e.g. convex plate and facial tissue on wooden base material. Suppresses generation of wooden composite board surface variation e.g. blister, at low cost Can be used effectively as base material. The figure shows the isometric view of a wooden composite board in a state wherein the thin middle density fiber board is bonded to wooden base material.1aMiddle density fiber board2Wooden base material
发明人 TERAYAMA KENICHI | INOUE TAKAO | MIWA KAZUHIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP2000102903A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 200029
DWPI 同族专利国家/地区计数 1

联系我们

服务热线:010-62889437
传真:010-62889437
邮箱:ham2003@caf.ac.cn
地址:北京市海淀区香山路中国林业科学研究院木材工业研究所

关于我们联盟章程会员风采联系我们

CopyAllRight © 2014  版权所有: 木地板专利联盟  京ICP备07017635号