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CARPET TYPE WOODY FLOOR HEATING PANEL | Sheet|cover type|formula wooden floor-heating panel

  2014/11/19   浏览:616

[导读] Wooden floor heating panel has heating fluid circulation conduits or heat generation wires embedded under connection flooring formed by flexibly connecting wooden pieces and printed with drawings on surface

公开号 JP11173579A
优先权号 JP1997342874A
优先权日 1997-12-12
申请号 JP1997342874A
申请日期 1997-12-12
公开日期 1999-06-29
IPC - 现版 F24D000316
IPC - 现版 - DWPI F24D000316
专利权人/申请人 SANYO ELECTRIC CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To improve workability, packing property and interior property by a method wherein a plurality of continuous wooden pieces are connected rollably by a flexible lining material and a picture pattern is applied on the surface of a connected floor material, in which a conduit for heating fluid or a heat generating electric wire is buried. SOLUTION: One of lengthwise left-and-right side surfaces of a continuous wooden piece 2 is provided with a male side projection/recess X and the other lengthwise left-and-right surface is provided with a female side projection recess part Y respectively while one of lengthwise side surfaces of a lateral rim member 4 is provided with the female side recessed part Y whereby the continuous woody pieces 2 and the continuous woody piece 2 as well as the lateral rim member 4 are engaged mutually through recessed and projected engagement. On the other hand, a lining member 3 is bonded onto the substantially whole area of the rear surface side of a connected floor member 1 to connect respective continuous woody pieces 2 and respective lateral rim members 4 so as to be rollable. In this case, the lining member 3 is constituted of a heat-equalizing sheet 9 made by aluminum foil, whose one part is contacted with a hot-water pipe 6, and a non-woven fabric 10, bonded to the outside of the heat-equalizing sheet 9. Further, a picture pattern is printed on the substantially whole area of the surface of connected floor panel 1 through transfer printing such as hot stamp or the like. COPYRIGHT: (C)1999,JPO&Japio SUBJECT of the Invention It can be construct|laid and used for floor levels, such as a flooring of an existing house, and enables it to provide the sheet|cover type|formula wooden floor-heating panel which it is not only excellent in a workability, but was excellent in packing property or interior design property. PROBLEM to be solved While connecting several elongate wooden pieces 2 with the flexible rear material 3 so that winding is possible, the connection flooring 1 in which the conduit|pipe 6 for heating fluid or the heat_generation|fever electric wire was embed|buried is provided. And it is the structure to which the pattern is given in the surface of this connection flooring 1. [MAT_IMAGE 000002]
摘要 - DWPI NOVELTY - The floor heating panel (A) has several elongate wooden pieces (2) which are connected by a flexible backing material into a connection flooring (1) under which some conduits (6) circulating a heating fluid or heat generation wires are embedded. Drawings are printed to the surface of the connection flooring. USETo perform floor heating inside room using warm water from a heat source. ADVANTAGEThe floor heating panel can be laid and used on the existing flooring of a room with an excellent workability, since the surface of the connection flooring is printed with drawings. The connection flooring can be rolled and folded compactly at the time of packing, since the wooden pieces of the connection flooring are connected by a flexible backing material. The wooden floor heating panel can be applied as the indoor furniture with an aesthetic sensation by the drawings printed to the surface of the connection flooring. A floor heating panel of excellent interior decoration property can be offered. DESCRIPTION OF DRAWING(S) - The figure is a top view showing components of wooden floor heating panel. (A) Wooden floor heating panel; (1) Connection flooring; (2) Elongate wooden pieces; (6) Conduits.
发明人 KATO HARUO | YANAGIDA SHINICHIRO | SATO HIROTOSHI | SUGAWARA TATSU | MURATA HIDEKAZU
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1997
DWPI 同族专利成员 JP11173579A
DWPI 同族专利成员计数 1
公开语言 JA
DWPI 更新 199936
DWPI 同族专利国家/地区计数 1

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