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国外专利

Composite ground heating floor | A composite floor heating floor board

  2014/11/19   浏览:553

[导读] Composite indoor floor heating board for use in building, has heat-conducting medium layer connected with substrate and surface of heat conducting part, heating part provided with heating surfaces, and heating element provided at cavity

公开号 CN102535815A
优先权号 CN201210047745A
优先权日 2012-02-27
申请号 CN201210047745A
申请日期 2012-02-27
公开日期 2012-07-04
IPC - 现版 E04F001502
IPC - 现版 - DWPI E04F001502
专利权人/申请人 LI Yuan,CN
摘要 (英语) The invention claims a composite floor heating floor board , belonging to the building decorative material technology field. Comprising the floor board main body, the floor board main body comprises a substrate and the heat-conducting medium layer composited on the lower surface of the substrate , one side of the floor main body is provided with a connecting groove and the other floor main body is adjacent to the connecting tenon can be buckled and connected with the transverse depth , the groove is bigger than the transverse tenon, and is locked on the inner side of the connecting groove to form a longitudinally extending heating element is contained chamber; the heating part is set in the heating element of thew contained cavity and the heat is transfereed to the substrate through the heat-conducting medium layer when heating, until heating the floor body, realizing the purpose of collecting heating indoor.
摘要 - DWPI The board has a floor main body (1) provided with a substrate (2). A lower surface of the substrate is provided with a heat-conducting medium layer (3). A side of the substrate is provided with a connecting structure. Another side of the substrate is provided with another connecting structure. The heat-conducting medium layer is connected with the substrate and an upper surface of a heat conducting part. A heating part is provided with two heating surfaces. A heating element (4) is arranged at a contained cavity. The heat-conducting medium layer is adhered with a decorative layer. Composite indoor floor heating board for use in a building. The board transfers heat to the substrate through the heat-conducting medium layer while heating the floor main body so as to realizing indoor floor heating purpose. The drawing shows a sectional view of a composite indoor floor heating board.1Floor main body2Substrate3Heat-conducting medium layer4Heating element
发明人 LI, Yuan
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2012
DWPI 同族专利成员 CN102535815A
DWPI 同族专利成员计数 1
公开语言 ZH
DWPI 更新 201255
DWPI 同族专利国家/地区计数 1

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