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Light and thin composite hot water heating floor | Light thin compound hot water heating floor

  2014/11/19   浏览:682

[导读] Light thin compound hot water heating floor e.g. wood floor, has calcium silicate board installed between lower metal heat-conducting layer and insulating layer, and pipe groove whose bottom end is located in silicate board

公开号 CN101699173A
优先权号 CN200910093345A
优先权日 2009-09-28
申请号 CN200910093345A
申请日期 2009-09-28
公开日期 2010-04-28
IPC - 现版 F24D000314 | E04F001500
IPC - 现版 - DWPI E04F001500 | F24D000312 | F24D000314
专利权人/申请人 Beijing Institute of Civil Engineering and Architecture,Beijing 100044,CN | XIE Wen-xin
摘要 (英语) A light thin compound hot water heating floor belongs to the technical field of heating. The floor comprises a ground decorating layer, an upper metal heat-conducting layer, a heating pipe, a lower metal heat-conducting layer, a calcium silicate board, an insulating layer and a floor slab. The calcium silicate board is capable of reinforcing the pressure resistance, the aging deformation resistance and the durability of the floor and reinforcing the heat conduction between the heating pipes; the compound heat-conducting structure composed of the upper metal heat-conducting layer, the heating pipe coated with the metal film at the outer surface, the lower metal heat-conducting layer and the calcium silicate board is capable of reinforcing the heat transmission of the floor layer effectively, making the ground temperature uniform, reducing the temperature stress influence and avoiding the deformation and the damage of the floor; the compound heat-conducting structure is good for levelling and reducing the downward heat loss by combining with the downside insulating layer. The floor structure is capable of improving the mechanical and thermal performances simultaneously, is suitable for the newly-built and built wood floor, cement, ceramic tile and stone surface layers, is capable of solving the limitation of the dry floor and avoids the disadvantage of the wet floor, the adaptability is strong, the construction is simple, and the maintenance is convenient.
摘要 - DWPI The floor has an upper metal heat-conducting layer (2) horizontally paved on top of a heating pipe (3) and a lower metal heat-conducting layer (4). The lower metal heat-conducting layer is provided with a pipe groove, and the heating pipe is installed in the pipe groove and located on the lower metal heat-conducting layer. A calcium silicate board (5) is installed between the lower metal heat-conducting layer and an insulating layer (6). A bottom end of the pipe groove is located in the calcium silicate board and placed in the insulating layer. Light thin compound hot water heating floor. Uses include but are not limited to a wood floor, cement tile, ceramic tile and a stone tile. The calcium silicate board reinforces pressure resistance, aging deformation resistance and durability of the floor, strengthens heat conduction between the heating pipes, and increases heat transmission of the floor layer effectively. The calcium silicate board makes uniform ground temperature, reduces temperature stress influence and avoids deformation and damage of the floor. The compound heat-conducting structure reduces downward heat loss by combining with the downside insulating layer. The floor structure improves mechanical and thermal performances simultaneously, avoids limitation of the dry floor and wet floor, and has high adaptability, simple construction and convenient maintenance. The drawing shows a sectional view of a light thin compound hot water heating floor. 2Upper metal heat-conducting layer3Heating pipe4Lower metal heat-conducting layer5Calcium silicate board6Insulating layer
发明人 XIE, Wen-xin | WANG, Sui-lin | PAN, Shu-yuan | YAN, Quan-ying
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2009
DWPI 同族专利成员 CN101699173A
DWPI 同族专利成员计数 1
公开语言 ZH
DWPI 更新 201032
DWPI 同族专利国家/地区计数 1

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