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国外专利

Bi-directional heat-conduction composite floor | Bidirectional heat conduction composite floor

  2014/11/19   浏览:617

[导读] Bi-directional heat conduction composite floor, has upper layer floor layer connected with surface of balance layer, where balance layer is provided with heating cable grooves that are transversely provided with heat guide grooves

公开号 CN203160630U
优先权号 CN201320133981U
优先权日 2013-03-22
申请号 CN201320133981U
申请日期 2013-03-22
公开日期 2013-08-28
IPC - 现版 E04F001502 | E04F001506
IPC - 现版 - DWPI E04F001502 | E04F001506
专利权人/申请人 SHEN Dong-liang,CN
摘要 (英语) This utility model claims a bidirectional heat-conductive composite floor, comprising a upper floor layer and a balance layer below the upper floor layer, wherein the upper layer floor layer is provided with a plurality of heating cable groove is heating cable heating is combined with the vertical face of the balance layer, while the transverse is provided with a heating cable groove and used for the heat energy of the heating cable groove quickly and uniformly to the plurality of heat guide board surface and indoor space. Upper-layer floor layer and balance layer is adhered to an organic whole according to the material of the adhesive, in which are respectively processed into splicing floor board with the and the notch. This utility model can realize three dimensional heat flow of heating, the structure is stable, safe and reliable, high heat efficiency, convenient installation, energy-saving and environment-friendly and so on.
摘要 - DWPI This utility model claims a bidirectional heat-conductive composite floor, comprising a upper floor layer and a balance layer below the upper floor layer, wherein the upper layer floor layer is provided with a plurality of heating cable groove is heating cable heating is combined with the vertical face of the balance layer, while the transverse is provided with a heating cable groove and used for the heat energy of the heating cable groove quickly and uniformly to the plurality of heat guide board surface and indoor space. Upper-layer floor layer and balance layer is adhered to an organic whole according to the material of the adhesive, in which are respectively processed into splicing floor board with the and the notch. This utility model can realize three dimensional heat flow of heating, the structure is stable, safe and reliable, high heat efficiency, convenient installation, energy-saving and environment-friendly and so on.
发明人 SHEN, Dong-liang
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2013
DWPI 同族专利成员 CN203160630U
DWPI 同族专利成员计数 1
公开语言 ZH
DWPI 更新 201377
DWPI 同族专利国家/地区计数 1

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