收藏本站设为首页联系我们
首页 > 专利介绍 > 国外专利 > Ground heating floor board | Floor heating floor

国外专利

Ground heating floor board | Floor heating floor

  2014/11/19   浏览:610

[导读] Ground heating floor, has decorative layer whose upper surface is provided with balance layer, base material layer formed with through-hole along length direction, and power supply electrically connected with electric heating wire

公开号 CN202927946U
优先权号 CN201220624759U
优先权日 2012-11-23
申请号 CN201220624759U
申请日期 2012-11-23
公开日期 2013-05-08
IPC - 现版 F24D001302 | E04F001502
IPC - 现版 - DWPI E04F001502 | F24D001302
专利权人/申请人 Kalma Floor (Suzhou) Co. Ltd.,CN
摘要 (英语) This utility model claims a floor heating type floor, comprising a decorative layer of the base material layer and a balance layer, a base material layer is processed to form at least one through hole along the length direction, the through hole is arranged with a power supply is electrically connected with the electric heating wire. Electric heating wire is capable of efficient electric energy is converted into heat energy, so the floor. This utility model is simple in structure, convenient to process, safe and environment-friendly, can be widely used in various places.
摘要 - DWPI This utility model claims a floor heating type floor, comprising a decorative layer of the base material layer and a balance layer, a base material layer is processed to form at least one through hole along the length direction, the through hole is arranged with a power supply is electrically connected with the electric heating wire. Electric heating wire is capable of efficient electric energy is converted into heat energy, so the floor. This utility model is simple in structure, convenient to process, safe and environment-friendly, can be widely used in various places.
发明人 WU, Chuan-ming
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2012
DWPI 同族专利成员 CN202927946U
DWPI 同族专利成员计数 1
公开语言 ZH
DWPI 更新 201366
DWPI 同族专利国家/地区计数 1

联系我们

服务热线:010-62889437
传真:010-62889437
邮箱:ham2003@caf.ac.cn
地址:北京市海淀区香山路中国林业科学研究院木材工业研究所

关于我们联盟章程会员风采联系我们

CopyAllRight © 2014  版权所有: 木地板专利联盟  京ICP备07017635号