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国外专利

Anti-damp and heat proof solid wooden structure floor with heat conductive holes on bottom plate | Bottom plate with hole for moisture resistance heat-resisting solid wood structure floor

  2014/11/19   浏览:673
公开号 CN2795340Y
优先权号 CN200520101747U
优先权日 2005-04-21
申请号 CN200520101747A
申请日期 2005-04-21
公开日期 2006-07-12
IPC - 现版 E04F001504 | F24D000314
专利权人/申请人 Yao Gen-fa
摘要 (英语) This utility model claims a bottom plate with hole of the moisture resistance heat-resisting solid wood structure floor. Is intended to provide a deformation is small, it is not easy to warp the moisture resistance heat-resisting solid wood structure floor. Comprises the most upper surface of the surface plate, the second layer plate, the third layer core plate, a fourth layer, core plate is provided with a spacing groove, the panel, the base plate, core plate, a bottom plate, a , is provided with groove and tenon corresponding to the long side of the two sides of the core plate is provided with heat conducting hole, the heat conducting core plate and the bottom plate of the groove. The groove between the heat-conducting hole and the core plate through heating plate for contact with the substrate, a conductive plate to the surface of the substrate for the upper surface of the floor heating. The floor is provided with heat transfer speed, strong integrity, small deformation, it is especially suitable for the north.
发明人 Yao, Gen-fa
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2005
公开语言 ZH

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