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Low-temperature heating solid wood composite floor and preparation method thereof | Low temperature heating solid wood composite floor and preparation method thereof

  2014/11/19   浏览:528

[导读] Low temperature heating solid wood composite floor has lower base material layer that is composed of multiple crossed layers of bottom layer and adhesive

公开号 CN102312545B
优先权号 CN201110186361A
优先权日 2011-07-05
申请号 CN201110186361A
申请日期 2011-07-05
公开日期 2013-12-11
IPC - 现版 E04F001502 | B32B003712 | E04F001518 | F24D001302 | H01R001302 | H01R001366 | H01R003106
IPC - 现版 - DWPI B32B003706 | B32B003712 | B32B003714 | E04F001502 | E04F001504 | E04F001518 | F24D001302 | H01R001302 | H01R001366 | H01R003106 | H05B000100 | H05B000302 | H05B000303 | H05B000310 | H05B000314 | H05B000320 | H05B000334 | B27D000100
专利权人/申请人 Shanghai Reli E-H Material Co. Ltd.,CN
摘要 (英语) The invention claims a lower-temperature heating solid wood composite floor, comprising an outer facing layer, a base material layer, a heating layer and a base material layer are overlapped and heat pressing. The upper part of the base material layer, a heating layer and a base material layer of thermal pressing a 9 layer and the emitting layer on the 5-7 layer and the heating layer of the part is formed on the base material layer, wherein the heating layer is a base material layer, the base material layer is composed of 3 to 5 layers, the lower base material layer is composed of 4 to 6 layers, the outer coat is set on the base material layer by hot pressing. The method of the invention is a low temperature heating solid wood composite floor can reduce the design power of the floor unit area, a surface of the highest temperature in 50 ℃ degrees centigrade to -55 degrees centigrade, solves the problem that the floor deformable and non-cracking and so on, improves the radiation and conduction of heat. The invention light uniform heat, energy-saving and environment-friendly, harmless to human body and is safe and convenient to use, the cost is low, and the structure is simple.
摘要 - DWPI The floor has an outer decorative surface layer (1) that is arranged on a base material layer (2) and formed by heat pressing. The two ends of the heating layer (3) are respectively provided with a pair of copper electrode. The base material layer is connected with heating layer. The lower base material layer (4) is connected with heating layer are respectively provided with a fireproof layer (5). The lower base material layer is composed of multiple crossed layers of bottom layer and adhesive. An INDEPENDENT CLAIM is included for manufacturing method of low temperature heating solid wood composite floor. Low temperature heating solid wood composite floor. The composite floor is energy-saving and environment-friendly, harmless to human body, safe and convenient to use, low cost and simple in structure. The drawing shows a schematic view of the solid wood composite floor.1Outer decorative surface layer2Base material layer3Heating layer4Lower base material layer5Fireproof layer
发明人 Unannounced Inventor
申请国家/地区 CN
优先权国家/地区 CN
优先权年 2011
DWPI 同族专利成员 CN102312545A | WO2013004074A1 | AU2012278749A1 | CN102312545B | CA2840892A1 | EP2733280A1 | US20140131342A1 | JP2014523984A | US8866048B2
DWPI 同族专利成员计数 9
公开语言 ZH
DWPI 更新 201411
DWPI 同族专利国家/地区计数 127

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