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国外专利

WOOD FLOORING WITH LAMINATED WOOD AND HDF USING SYMMETRIC STRUCTURE AND PROCESS FOR MANUFACTURING THE SAME | PLANCHER EN BOIS À BOIS LAMELLÉ ET PANNEAU DE FIBRES HAUTE DENSITÉ UTILISANT UNE STRUCTURE SYMÉTRIQUE ET SON PROCÉDÉ DE FABRICATION

  2014/11/19   浏览:475

[导读] Wood flooring for under floor heating system has upper layer and lower layer formed symmetric with respect to high density fiberboard layer

公开号 WO2007086632A1
优先权号 KR20068034A
优先权日 2006-01-26
申请号 WO2006KR2923A
申请日期 2006-07-25
公开日期 2007-08-02
IPC - 现版 B32B002110
IPC - 现版 - DWPI B27D000500 | B27M000300 | B27M000304 | B32B002100 | B32B002740 | B32B000306 | B32B003712 | B32B003804 | E04F001504 | B32B002104 | B32B002108 | B32B002110
专利权人/申请人 LG CHEM LTD.,KR | HWANG Sung-Chul,KR | SUNG Jae-Wan,KR | NAM Seung-Baik,KR | LEE Seung-Hun,KR | KIM Jong-Bum,KR | KIM Bum-Soo,KR
摘要 (英语) Disclosed is a wood flooring containing laminated wood and high- density fiberboard using a symmetric structure and a process for manufacturing the same. The wood flooring includes a high-density fiberboard core layer and an upper laminated wood layer and lower laminated wood or veneer layer symmetrically stacked about the high-density fiberboard core layer to achieve a stable structure, and the lower laminated wood or veneer layer has a density of 100 + 30% of that of the upper laminated wood layer to keep the balance therebetween. With this configuration it is possible to completely eliminate deformation problems caused by variation of environmental conditions such as temperature, humidity, etc., and to impart the natural texture of raw lumber and high durability to the flooring surface.
摘要 - DWPI A wood flooring comprises of a balance layer (60), a first adhesive layer (50), a high-density fiberboard (HDF) layer (40), a second adhesive layer (30), and a laminated wood layer (20) stacked in order from the bottom. The upper layers and the lower layers are formed symmetric with respect to the high density fiberboard layer. An INDEPENDENT CLAIM is also included for a manufacturing method of wood flooring. For under floor heating system. Eliminates deformation problems caused by vibration of environmental conditions e.g. temperature, humidity and imparting the natural texture of raw lumber and high durability to the flooring surface. Ensures favorable dimensional stability against heat and moisture. Improves workability and productivity in integration of the wood and the high density fiberboard. The figure shows the sectional view of the wood flooring.20Laminated wood layer30Second adhesive layer40HDF layer50First adhesive layer60Balance layer
发明人 HWANG, Sung-Chul | SUNG, Jae-Wan | NAM, Seung-Baik | LEE, Seung-Hun | KIM, Jong-Bum | KIM, Bum-Soo
申请国家/地区 WO
优先权国家/地区 KR
优先权年 2006
DWPI 同族专利成员 WO2007086632A1 | JP2008510641A | KR679815B1 | US20090197036A1
DWPI 同族专利成员计数 4
公开语言 EN
DWPI 更新 200759
DWPI 同族专利国家/地区计数 113

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