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LATENT HEAT STORAGE FLOOR MATERIAL | Latent heat storage flooring

  2014/11/19   浏览:590

[导读] Latent heat storage flooring for indoor subfloor, has recessed portion that is formed in lower surface of main portion, and packing bag-like container which is accommodated in inner bottom face of recessed portion

公开号 JP2012077492A
优先权号 JP2010222295A
优先权日 2010-09-30
申请号 JP2010222295A
申请日期 2010-09-30
公开日期 2012-04-19
IPC - 现版 E04F001518 | F24D001100
IPC - 现版 - DWPI E04F001518 | F24D001100
专利权人/申请人 DAIKEN CORP
摘要 (英语) PROBLEM TO BE SOLVED: To eliminate obstruction of heat transfer by a gap and to improve responsiveness of a latent heat storage material, in a heat storage floor material constructed on an indoor sub-floor. SOLUTION: The latent heat storage floor material A includes: a floor material body 1 provided with a recess 6 formed on the lower surface and fixed to the sub-floor at a part other than the recess 6; a flexible package-like container 8 housed inside the recess 6 of the floor material body 1 in the state of being heat transferrably bonded to the inner bottom surface of the recess 6, and composed of a heat transfer material filled with the latent heat storage material; and a cushion material 13 for energizing the container 8 so as to heat transferrably press the upper surface to the inner bottom surface of the recess 6. SUBJECT of the Invention The thermal storage flooring constructed on an indoor subfloor WHEREIN: The hindrance of the heat transfer by a clearance gap is eliminated, and responsiveness of a latent heat storage material is made to be improved. PROBLEM to be solved The recessed part 6 is formed in a lower surface, The flooring main body 1 fixed to a subfloor in parts other than the recessed part 6, The packing bag-like container 8 which has the flexibility which consists of heat-transfer material with which it was accommodated in the inner bottom face of this recessed part 6 in the state adhere|attached so that heat transfer was possible, and the latent heat storage material was filled in the recessed part 6 of this flooring main body 1, It is set as the latent heat storage flooring A provided with the cushioning material 13 urged|biased so that heat transfer is possible and this container 8 may be pressed against an upper surface by the inner bottom face of the recessed part 6. SELECTED DRAWINGS FIG. 2 [MAT_IMAGE 000002]
摘要 - DWPI The flooring (A) has a recessed portion (6) that is formed in lower surface of main portion. A packing bag-like container (8) is accommodated in the inner bottom face of recessed portion, and a heat-transfer material is accommodated in inner bottom face of recessed portion. A cushioning material (13) is biased so that heat transfer is possible, and container is pressed against the upper surface of the recessed portion. Latent heat storage flooring for indoor subfloor (claimed). The hindrance of heat transfer due to the clearance gap can be eliminated. The responsiveness of latent heat storage material can be improved. The drawing shows a sectional view of the latent heat storage flooring.6Recessed portion8Packing bag-like container11Latent heat storage material13Cushioning materialAFlooring
发明人 ISHIGURO SHIGENORI | NAKAMURA TETSUMI | KUBO KOHEI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2010
DWPI 同族专利成员 JP2012077492A | JP05325864B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 201227
DWPI 同族专利国家/地区计数 1

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