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FLOOR-HEATING DEVICE AND ITS REMODELING METHOD | A floor-heating apparatus and its reformation method

  2014/11/19   浏览:553

[导读] Heating apparatus for use to heat flooring has non-bonded compound soaking heating board which is fixed to small joist by fixing tool and formed by adhering soaking heating sheet to thin plate material

公开号 JP2008051422A
优先权号 JP2006228672A
优先权日 2006-08-25
申请号 JP2006228672A
申请日期 2006-08-25
公开日期 2008-03-06
IPC - 现版 F24D001302 | E04F001500 | E04F001518 | F24D000316
IPC - 现版 - DWPI E04F001500 | E04F001518 | F24D001302 | F24D000316
专利权人/申请人 MATSUSHITA ELECTRIC WORKS LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor-heating device and its remodeling method providing reuse of a floor-heating panel, and providing easy remodeling of a surface layer such as a flooring material portion. SOLUTION: The floor-heating device is formed by embedding the floor-heating panel A comprised by providing a heating element 4 in a heat insulating base material 3 between small joists 5 provided on a floor backing F at a certain interval, covering a composite soaking plate 1 fixed to the small joist 5 by a fixture on top faces of the floor-heating panel A and the small joists 5 without adherence to the floor-heating panel A, and adhering a flooring material 2 to the composite soaking plate 1. In the floor-heating device and its remodeling method, the composite soaking plate 1 is comprised by combining a thin plate material 11 and a soaking sheet 12. COPYRIGHT: (C)2008,JPO&INPIT SUBJECT of the Invention While a floor-heating panel is reusable, a flooring part etc. provides the floor-heating apparatus which can reform surface layer easily, and its reformation method. PROBLEM to be solved The floor-heating panel A formed by providing internally the heat generating body 4 to the adiabatic|thermal-insulating board|substrate 3 is embed|buried between the small joists 5 in which it was provided by Subfloor F by the fixed space|interval, On the upper surface of the said floor-heating panel A and the said small joist 5, this floor-heating panel A has the non-bonded compound soaking|uniform-heating board 1 fixed to the small joist 5 by the fixing tool, and it is coveringly provided, Furthermore, it is the floor-heating apparatus which the flooring 2 adhere|attached this compound soaking|uniform-heating board 1, and was formed, Comprising: These compound soaking|uniform-heating boards 1 are a floor-heating apparatus with which the thin-plate material 11 and the soaking|uniform-heating sheet|seat 12 are compounded, and its reformation method. SELECTED DRAWINGS FIG. 1 [MAT_IMAGE 000002]
摘要 - DWPI The floor heating apparatus has non-bonded compound soaking heating board (1) which is fixed to small joist by fixing tool and formed by adhering the soaking heating sheet (12) to thin plate material (11). The flooring (2) of the floor heating apparatus is attached to compound soaking heating board. An INDEPENDENT CLAIM is also included for a reformation method of the floor heating apparatus. Floor heating apparatus. Reforms the surface layer of the floor heating panel easily while being able to reuse the floor heating panel without causing any damage to it. The drawing shows the exploded perspective view of the structure of the floor-heating apparatus.1Compound soaking heating board2Flooring3Thermal insulating board4Heat generating body5Small joists11Thin plate material12Soaking heating sheetAFloor heating panel.
发明人 FURUICHI SUNAO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2006
DWPI 同族专利成员 JP2008051422A | JP04997878B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200819
DWPI 同族专利国家/地区计数 1

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