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HOT WATER FLOOR HEATING DEVICE | Warm water floor-heating apparatus

  2014/11/19   浏览:605

[导读] Floor-panel integrated type warm water floor-heating apparatus includes lead-out groove having pair of recesses formed in it, to absorb surplus-length portion of flexible piping

公开号 JP2007170722A
优先权号 JP2005366824A
优先权日 2005-12-20
申请号 JP2005366824A
申请日期 2005-12-20
公开日期 2007-07-05
IPC - 现版 F24D000316 | E04F001518
IPC - 现版 - DWPI E04F001518 | F24D000312 | F24D000316
专利权人/申请人 MATSUSHITA ELECTRIC WORKS LTD
摘要 (英语) PROBLEM TO BE SOLVED: To easily perform pipe connection between floor panels adjacent to each other on a floor, and to improve the settlement of flexible pipes after transportation and pipe connection. SOLUTION: In this hot water floor heating device, a piping groove 6 near a drawing-out port 4 of the floor panel 1 is used as a drawing-out groove 8 for drawing out one tip 7a of the flexible pipe 7 from the drawing-out port 4 to one side face 2 of the floor panel 1 in the oblique direction, a first recessed portion 9a for absorbing the extra length of the flexible pipe 7 is formed at a depth portion with respect to a constricted portion 24 of the drawing-out groove 8, a second recessed portion 9b for absorbing the extra length of the flexible pipe 7 is formed at a front portion with respect to the constricted portion 24, one tip 7a of the flexible pipe 7 of one of the floor panels adjacent to each other in the width direction A is drawn out to the drawing-out port 4 from the drawing-out groove 8, and led into a leading-in port 5 of the other floor panel 1 connected with the other tip 7b of the flexible pipe 7. COPYRIGHT: (C)2007,JPO&INPIT COPYRIGHT: (C)2006,JPO&NCIPI SUBJECT of the Invention While making the piping connection between adjacent floor panels easily above the floor level, carry out a settlement of flexible piping favorably after the time of conveyance, and a piping connection. PROBLEM to be solved It is set as the lead-out|drawer groove part 8 for piping groove|channel 6 part of the lead-out|drawer opening|mouth 4 vicinity of the floor panel 1 to pull out one front-end|tip part 7a of the flexible piping 7, and pull out from an opening|mouth 4 to the diagonal direction with respect to the 1 side 2 of the floor panel 1. The 1st recess part 9a for absorbing the surplus-length part of the flexible piping 7 is formed in an inside rather than the constriction part 24 of the lead-out|drawer groove part 8, The 2nd recess part 9b for absorbing the surplus-length part of the flexible piping 7 is formed in a near side part rather than the constriction part 24, One front-end|tip part 7a of the flexible piping 7 of adjacent one floor panel 1 is pulled out in the width direction A, and it pulls out from the groove part 8, and pulls out to an opening|mouth 4, It is a warm water floor-heating apparatus formed by drawing in in the drawing-in opening|mouth 5 of the other floor panel 1, and connecting with the other front-end|tip part 7b of the flexible piping 7. SELECTED DRAWINGS FIG. 1 [MAT_IMAGE 000002]
摘要 - DWPI The floor-panel integrated type warm water floor-heating apparatus has a lead-out groove (8) for piping groove (6) of a lead-out opening (4) vicinity of the floor panel (1), to pull out the front end (7a) of the flexible piping (7) and to pull out from the lead-out opening. The lead-out groove has a pair of recesses (9a,9b) formed in it, to absorb the surplus-length portion of the flexible piping. For floor-panel integrated type warm water floor-heating apparatus. Enables to make the piping connection between the adjacent floor panels easily above the floor level. Enables to carry out settlement of the flexible piping favorably after conveyance. The figure shows a top view and a side sectional drawing of the floor panel. (Drawing includes non-English language text)1Floor panel4Lead-out opening6Piping groove7Flexible piping7aFront end of flexible piping8Lead-out groove9a,9bRecesses
发明人 SHIBATA KENICHIRO | HOTTA TOSHIRO | NAGAYASU YOHEI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2005
DWPI 同族专利成员 JP2007170722A | JP04434139B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200749
DWPI 同族专利国家/地区计数 1

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