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HEATING FLOOR STRUCTURE

  2014/11/19   浏览:546

[导读] Floor heating structure has adhesive tape joining lower metal layer of wooden floor with upper metal layer of heater panel

公开号 JP2000199332A
优先权号 JP1998313765A
优先权日 1998-11-04
申请号 JP1999313011A
申请日期 1999-11-02
公开日期 2000-07-18
IPC - 现版 E04F001518 | E04F001504 | F24D000316 | F24D001302 | F24D001902
IPC - 现版 - DWPI E04F001504 | E04F001518 | F24D001302 | F24D001900 | F24D000312 | F24D001902 | F24D000316
专利权人/申请人 ASAHI WOODTEC CORP
摘要 (英语) PROBLEM TO BE SOLVED: To securely fix a wooden floor member to a heat generating panel disposed on an underfloor base using double-sided adhesive tape without generating such problems as those generated when using adhesive agent or nails in a heating floor structure. SOLUTION: A heating floor structure comprises plural floor heating heat generating panels 2 disposed in a condition of contacting with each other on an underfloor base 1, and plural wooden floor members 3 disposed on the heat generating panels 2 in such a condition as to be in contact with each other. A metal layer 4 is provided on an upper surface of each heat generating panel 2, a metal layer 5 is provided on a lower surface of each wooden floor member 3, and both metal layers 4, 5 are jointed with each other through heat-resistant double-sided adhesive tape 6 along the whose body of each wooden floor member 3. COPYRIGHT: (C)2000,JPO&Japio SUBJECT of the Invention Heating floor structure WHEREIN: When using an adhesive agent and nails, a wooden flooring is reliably fixed with respect to the heat_generation|fever panel arrange|positioned on a subfloor using the double-sided adhesive tape which does not produce a problem [ like ]. PROBLEM to be solved A heating floor structure is with several floor heating panels 2 arrange|positioned at the state which touches mutually on the subfloor 1, It consists of several wooden floorings 3 arrange|positioned at the state which touches mutually on these heat_generation|fever panel 2, While the metal layer 4 is provided in the upper surface of each heat_generation|fever panel 2, the metal layer 5 is provided in the lower surface of each wooden flooring 3, and both metal layer 4 and 5 are joined via the heat resistant double-sided adhesive tape 6 in each whole wooden flooring 3. [MAT_IMAGE 000002]
摘要 - DWPI Heat emitting panels (2) is provided between underfloor (1) and upper side wooden floor (3). Metallic layers (4,5) are provided in the upper side of panel and lower side of wooden floor respectively. Adhesive tape (6) bonds the two metallic layer so as to join the panels with wooden floor. Floor heating. The adhesive tape reliably joins the heater panel with the wooden floor. Heating is uniform through out because of the metal layer and hence there is no bending of the wooden floor due to unequal heating. The figure shows the floor heater structure.1Underfloor2Heat emitting panels3Wooden floor4,5Metallic layers6Adhesive tape
发明人 MIHASHI HIROSHI | YODONO DAISUKE | ARAKAWA MASAHIRO | MUKOYAMA SHUJI | NAGAMI YOSHIHIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP2000199332A | JP04314419B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200046
DWPI 同族专利国家/地区计数 1

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