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国外专利

HEATING FLOOR STRUCTURE | Heating floor construction

  2014/11/19   浏览:557

[导读] Floor heating structure has three-layered laminate structure with heat conductive and flexible aluminum foil adhered with sheets on either sides, provided on heating wires

公开号 JP2004285615A
优先权号 JP200376934A
优先权日 2003-03-20
申请号 JP200376934A
申请日期 2003-03-20
公开日期 2004-10-14
IPC - 现版 E04F001518 | F24D001302
IPC - 现版 - DWPI E04F001518 | F24D001302
专利权人/申请人 NODA CORP
摘要 (英语) PROBLEM TO BE SOLVED: To uniformly transfer heat, which is generated by a heater wire, to a floor board. SOLUTION: A heating floor structure is equipped with a sub-floor material 40, the heater wire 2 which is provided on the sub-floor material 40, a three-layer laminate 16 which is provided by abutting on the heater wire 2, and the floor board 24 which is provided on the three-layer laminate 16; the heater wire 2 is provided in a meandering manner; and the three-layer laminate 16 is stuck by sandwiching aluminum foil 21 between two sheets 18 and 19. A small floor joist 32, which is fixed onto the three-layer laminate 16, and an elastic base material 32, which is provided between the heater wire 2 and the sub-floor material 40, are provided; the floor joist 34 is arranged so as not to overlap the heater wire 2; and the floor board 24 is arranged in such a manner that a joint 26 of the floor board is positioned on the floor joist 34, and fixed to the sub-floor material 40 via the three-layer laminate 16 and the base material 32. COPYRIGHT: (C)2004,JPO&Japio SUBJECT of the Invention The heat|fever generate|occur|produced in heater wires is uniformly transmitted to a floor board. PROBLEM to be solved Under-floor ground material 40, Heater wires 2 provided on this under-floor ground material 40, The three-layer laminate body 16 contact|abutted and provided on these heater wires 2, The floor board 24 provided on this three-layer laminate body 16 is provided, Heater wires 2 are provided in an undulation state, and the three-layer laminate body 16 is adhered on both sides of aluminum foil 21 among the two sheet|seats 18 and 19. Furthermore, the base material 32 which is provided between the small joist 34 fixed on the three-layer laminate body 16, and heater wires 2 and the under-floor ground material 40, and has resiliency is provided, It arranges, as that it may not overlap with heater wires 2, a floor board 24 is arranged so that joint 26 of a floor board may position on the small joist 34, and the small joist 34 is fixed to the under-floor ground material 40 through the three-layer laminate body 16 and a base material 32. SELECTED DRAWINGS FIG. 1 [MAT_IMAGE 000002]
摘要 - DWPI A structure comprises the heating wires (2) provided in an undulation state on the surface of an under-floor ground material (40). A three-layered laminate structure (16) comprising heat conductive and flexible aluminum foil (21) adhered with the sheets (18,19) on either sides, is provided on the heating wires. A floor board (24) is provided on the laminate structure. For heating floor, by heating floor board. The heat produced by the heating wires is uniformly transmitted to a floor board. The figure shows a sectional view of the floor heating structure.1heater mat2heating wire16three-layered laminate structure18,19sheets21aluminum foil24floor board40under-floor ground material
发明人 MIYAMA SEIJI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2003
DWPI 同族专利成员 JP2004285615A | JP04157784B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200469
DWPI 同族专利国家/地区计数 1

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