收藏本站设为首页联系我们
首页 > 专利介绍 > 国外专利 > FLOOR-HEATING PANEL

国外专利

FLOOR-HEATING PANEL

  2014/11/19   浏览:507

[导读] Floor heating panel for buildings, has line heater positioned in groove formed on upper side of shock absorbing sheet and covered by wooden board with bottom conductive sheet

公开号 JP2001201071A
优先权号 JP200013882A
优先权日 2000-01-18
申请号 JP200013882A
申请日期 2000-01-18
公开日期 2001-07-27
IPC - 现版 F24D001302
IPC - 现版 - DWPI F24D001302
专利权人/申请人 EIDAI CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor-heating panel that can be manufactured simply and inexpensively, can prevent a built-in wire heater from being damaged easily, and can be attached directly. SOLUTION: This floor-heating panel is equipped with a panel base 11, that is made of a woody plate, a wire heater 14 that is used as an electrical heating element being bonded onto the lower surface of a soaking material 14 with superior thermal conductivity in advance, and a buffer material 15 having flexibility, where rubber hardness is 70 degrees or higher. The buffer material 15 is applied onto the back surface of the panel base 11 via the soaking material 13. The buffer material 15 is formed into a sheet shape that is formed by crossing a number of polyester fibers, and a heater accommodation groove 15a for accommodating the wire heater 14 is formed on the upper surface along a prescribed heater pattern by heat-press machining. Even if a load being generated in a normal usage state is applied to the panel base 11, the buffer material 15 itself cannot be compressed greatly, and the wire heater 14 accommodated in the heater accommodation groove 15a cannot be damaged easily. COPYRIGHT: (C)2001,JPO&Japio SUBJECT of the Invention The floor-heating panel of the direct sticking type with which, and it can manufacture to a low price and the line heater incorporated further cannot receive damage easily is provided. PROBLEM to be solved The panel base material 11 which consists of wooden boards, the line heater 14 as a heat generating body previously adhere|attached on the lower surface of the heat conductive favorable soaking|uniform-heating material 13, and the rubber hardness which has a softness|flexibility are provided with the shock absorbing material 15 of 70 degree|times or more, The shock absorbing material 15 is stuck by the back surface of the panel base material 11 via the soaking|uniform-heating material 13. The shock absorbing material 15 is the sheet-like article formed by entangling many polyester fibers, The heater accommodation groove|channel 15a in which the line heater 14 is accommodated is formed in the upper surface by hot press processing along the predetermined heater pattern. Even when the load generate|occur|produced in a normal use state is added to the panel base material 11, shock absorbing material 15 itself is not compressed largely, and the line heater 14 accommodated in the heater accommodation groove|channel 15a is difficult to receive damage. [MAT_IMAGE 000002]
摘要 - DWPI The floor heating panel (1) has line heater (14) positioned in the groove (15a) formed on upper side of shock absorbing sheet (15) and covered by wooden board (11). The thermally conductive sheet (13) bonded with line heater, is inserted and bonded between shock absorbing sheet and wooden board. The flexibility of sheet (15) formed by polyester fiber is 70% or more. For buildings. When the load acts on usual condition on the panel top board, the shock absorbing sheet is not compressed largely, as the sheet has specific flexibility. Since grooves are provided for line heater, the damage to the heater is avoided. The manufacturing process is simple. The figure shows a sectional view of floor heating panel.1Floor heating panel11Wooden board13Thermally conductive sheet14Line heater15Shock absorbing sheet15aGroove
发明人 TERAYAMA KENICHI | MIWA KAZUHIRO | KOIKE HIROTAKA
申请国家/地区 JP
优先权国家/地区 JP
优先权年 2000
DWPI 同族专利成员 JP2001201071A | JP04100851B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200219
DWPI 同族专利国家/地区计数 1

联系我们

服务热线:010-62889437
传真:010-62889437
邮箱:ham2003@caf.ac.cn
地址:北京市海淀区香山路中国林业科学研究院木材工业研究所

关于我们联盟章程会员风采联系我们

CopyAllRight © 2014  版权所有: 木地板专利联盟  京ICP备07017635号