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国外专利

FLOOR HEATING PANEL AND FLOOR HEATING STRUCTURE USING IT | A floor-heating panel and the floor-heating structure using the floor-heating panel

  2014/11/19   浏览:522

[导读] Floor heating panel structure has gusset plate stuck to back side of floor heating panel which is laid on joist

公开号 JP11270867A
优先权号 JP199892780A
优先权日 1998-03-20
申请号 JP199892780A
申请日期 1998-03-20
公开日期 1999-10-05
IPC - 现版 E04F001518 | F24D001302
IPC - 现版 - DWPI E04F001518 | F24D001302
专利权人/申请人 EIDAI CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To provide a floor finishing material separation-type floor-heating panel that can essentially maintain the thickness being the same as that of a subfloor material being normally used and at the same time sufficiently secure strength required for the subfloor material, and to provide floor heating structure using the floor heating panel. SOLUTION: A panel is constituted of a plurality of joists 10 being provided in parallel at fixed intervals, a floor heating panel 20 being laid on the joists 10, and a floor finishing material 30 being laid on the floor heating panel 20. The floor heating panel 20 is constituted of a panel body 21 that consists of three-ply plywood with a thickness of 12 mm being the same as that of a subfloor material being normally used, five-ply plywood, or the like, an electric heater that is used as an electrical heating element being built into the panel body 21, and a reinforcing plate 26 that is applied onto the rear surface of the panel body 21 and consists of plywood with a thickness of 3 mm. Then, aluminum foil is applied onto the surface of the floor heating panel 20 in advance, where the aluminum foil is used as a soaking sheet for uniformly transferring the heat of the electric heater to the floor finishing material 30. COPYRIGHT: (C)1999,JPO&Japio SUBJECT of the Invention The floor-heating panel of the flooring material separated|isolated type which can fully ensure the intensity|strength requested|required as a subfloor material, and the floor-heating structure using the floor-heating panel are provided maintaining the thickness essentially the same as the subfloor material by which normal use is carried out. PROBLEM to be solved It is comprised from several joists 10 parallelly arrange|positioned by the fixed space|interval, the floor-heating panel 20 construct|laid on this joist 10, and the flooring material 30 construct|laid on this floor-heating panel 20. The floor-heating panel 20 is with the panel main body 21 which consists of 3 ply plywood, 5 ply plywood, etc. of the same thickness (12 mm) as the subfloor material by which normal use is carried out, It is comprised from the electric heater as a heat generating body incorporated in this panel main body 21, and the reinforcement board 26 consisting of the plywood of thickness 3mm stuck by the back surface of the panel main body 21, The aluminum foil is previously stuck by the surface of the floor-heating panel 20 as a soaking|uniform-heating sheet|seat for transmitting the heat of an electric heater to the flooring material 30 uniformly. [MAT_IMAGE 000002]
摘要 - DWPI NOVELTY - The floor heating panel (20) is installed between a joist (10) and a flooring material (30). A heat emitter is incorporated in the heating panel and a gusset plate (26), arranged to the position corresponding to the portion between the joists is stack to the back side of the panel and a thermally conductive evenly heated sheet is stuck to the surface of the panel. USEFloor heating panel. ADVANTAGEAs the gusset plate is stuck between the joists the thickness of the panel is not enlarged. Strength of the panel is increased. Identical thickness is substantially maintained with the usual underflow ground material used. A step is not caused between the usual floors which are not heated. DESCRIPTION OF DRAWING(S) - The figure shows a schematic sectional view of the floor heating structure. (10) Joist; (20) Floor heating panel; (26) Gusset plate; (30) Flooring material.
发明人 TERAYAMA KENICHI | YAMADA KAZUHIRO | INOUE TAKAO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP11270867A | JP03986156B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 199953
DWPI 同族专利国家/地区计数 1

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