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STRUCTURE OF FLOOR HEATING MATERIAL | The structure of a heating flooring

  2014/11/19   浏览:1262

[导读] Heating floor material structure

公开号 JP11337094A
优先权号 JP1998144871A
优先权日 1998-05-26
申请号 JP1998144871A
申请日期 1998-05-26
公开日期 1999-12-10
IPC - 现版 E04F001518 | F24D000316
IPC - 现版 - DWPI E04F001518 | F24D000312 | F24D000316
专利权人/申请人 MATSUSHITA ELECTRIC WORKS LTD
摘要 (英语) PROBLEM TO BE SOLVED: To improve the work execution property by enabling the work execution of a warm water pipe and the work execution of heating floor material from above underfloor base material, and also to raise the heat efficiency and the temperature rise property while raising the load resistance of a heating body panel. SOLUTION: A heating body panel 3 which has a pipe storage groove 17 opened on rear side, and a cover panel 6 which has a header storage groove 5 opened on rear side, are laid side by side on the surface of underfloor base material 1. The thickness L from the surface of the heating body panel 3 to the bottom 17a of the pipe storage groove 17 is set to 3 mm-9 mm. A warm water pipe 2 is stored in the pipe storage groove 17. The extension 12 of the warm water pipe 2 exposed from the end of the heating body panel 3 is connected to the header 4 installed on the underfloor base material 1. A cover panel 6 is put on it from above the header 4, whereby the header 4 is stored in the header storage groove 5. COPYRIGHT: (C)1999,JPO&Japio SUBJECT of the Invention Construction of a warm water pipe and construction of a heating flooring become respectively possible from the upper direction of a subfloor material, and a workability becomes good, and also a thermal efficiency and temperature rising property are improved for the load carrying capacity of a heating main body panel with slight height. PROBLEM to be solved On the surface of the subfloor material 1, the heating main body panel 3 which has the pipe holding-groove 17 opened to the back surface side, and the lid|cover panel 6 which has the header holding-groove 5 opened to the back surface side are put in order and construct|laid. Thickness L from the surface of the heating main body panel 3 to the groove bottom 17a of the pipe holding-groove 17 is set to 3 mm - 9 mm. The warm water pipe 2 is accommodated in the pipe holding-groove 17. The extension part 12 of the warm water pipe 2 exposed from the edge part of the heating main body panel 3 is connected to the header 4 installed on the subfloor material 1. The lid|cover panel 6 is covered from on the header 4, and the header 4 is accommodated in the header holding-groove 5. [MAT_IMAGE 000002]
摘要 - DWPI The heating floor material structure has a lid panel (6) that covers the header (4) stored in a header holding groove (5). The header, at which the extension portion (12) of a warm water pipe (2) is exposed more than the end of a heating body panel (3), is installed on an underground material (1). The heating body panel has a pipe holding groove (7) opened to the back side on the surface of the underground material. The lid panel is arranged and laid with the header holding groove opened to the back side. The thickness (L) of the heating body panel from the surface of the pipe holding groove to the groove bottom is set in 3 to 9mm. The warm water pipe is stored in the pipe holding groove. None given. Ensures good thermal efficiency and temperature rise due to improved construction of floor material and heating body panel. Restrains heat loss of warm water due to eliminated winding sections of warm water pipe which cool warm water easily. Ensures easy construction of warm water pipe in a small area. Improves thermal efficiency due to reduced resistance of warm water and one-way flow of warm water. Improves construction reliability due to eliminated e.g. lift-up work. The figure shows the cross-sectional view of the heating floor material structure.1Underground material2Warm water pipe3Heating body panel4Header5Header holding groove6Lid panel7Pipe holding groove12Extension portionLThickness of heating body panel
发明人 TAKASE YOSHINARI | HAYASHI MORIO | KANAI HIDEKI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP11337094A | JP03658997B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200009
DWPI 同族专利国家/地区计数 1

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