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国外专利

OVERLAY WOODEN FLOOR HEATING PANEL | Sheet|cover type|formula wooden floor-heating panel

  2014/11/19   浏览:573

[导读] Wooden floor heating panel

公开号 JP11264558A
优先权号 JP199868555A
优先权日 1998-03-18
申请号 JP199868555A
申请日期 1998-03-18
公开日期 1999-09-28
IPC - 现版 F24D000316 | F24D001302
IPC - 现版 - DWPI F24D000316 | F24D001302
专利权人/申请人 SANYO ELECTRIC CO LTD
摘要 (英语) PROBLEM TO BE SOLVED: To lay a floor heating panel on a floor such as the flooring of an existing residence with good workability and without deteriorating the fundamentals of the floor of a room and urge thermal conduction from conduits for heating fluid or heat generating electric wires to a panel body. SOLUTION: A sheet type wooden floor heating panel comprises recessed grooves 5 for embedding conduits 6 for heating fluid or heat generating electric wires are provided on the back surface of a wooden floor heating panel body 1 provided on the floor of a house and the conduits 6 for heating fluid or the heat generating electric wires embedded in the recessed grooves 5. A thermal conduction urging film in which metallic powder with good thermal conductivity is mixed is formed substantially on all area of the back surface of the wooden floor heating panel main body including the recessed grooves 5. COPYRIGHT: (C)1999,JPO&Japio SUBJECT of the Invention Without impairing the keynote of 室床, it can be construct|laid and used for floor levels, such as a flooring of an existing house, and is excellent in a workability, Moreover, it enables it to accelerate|stimulate the heat conduction to the panel main body from the conduit|pipe for heating fluid, or a heat_generation|fever electric wire. PROBLEM to be solved It is a sheet|cover type|formula wooden floor-heating panel formed by providing the ditch|groove 5 for embedding|burying in the back surface of the wooden floor-heating panel main body 1 installed in the floor level of a house, and embed|burying the conduit|pipe 6 for heating fluid, or a heat_generation|fever electric wire under this ditch|groove 5 for embedding|burying, Comprising: It is the structure which forms thermally-conductive acceleration|stimulation coating-film イ which made good heat conductive metal powder mixed in the back surface substantially whole area|region of the wooden floor-heating panel main body 1 containing the said ditch|groove 5 for embedding|burying. [MAT_IMAGE 000002]
摘要 - DWPI The panel body (1) consists of several parallelly arranged elongated plates, which are flexibly coupled at their back sides in order to enable their winding. The pipe (6) for conducting heating fluid is laid in grooves (5) formed at the back side of the panel body and a heat conducting film with good thermal conductivity is bonded to that side. For floor heating. The panel, which is easily laid on existing floor foundation, effects spreading of heat to a wide area. The figure shows the cross sectional view of the panel.1Panel body5Grooves6Pipe
发明人 KASUKAWA NOBUYUKI
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP11264558A | JP03306369B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 199952
DWPI 同族专利国家/地区计数 1

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