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STRUCTURE OF FLOOR-HEATED BUILDING FLOOR | The structure of the building floor|bed by which floor heating was carried out

  2014/11/19   浏览:571

[导读] Floor for e.g. building, comprises wooden surface floor boards spread over heat insulating layer provided at top surface of foundation floor, and pipe grooves formed at bottom surfaces of the wooden surface floor boards

公开号 JP2000064579A
优先权号 JP1998251972A
优先权日 1998-08-21
申请号 JP1998251972A
申请日期 1998-08-21
公开日期 2000-02-29
IPC - 现版 E04F001518 | F24D000314 | F24D000316
IPC - 现版 - DWPI E04F001518 | F24D000312 | F24D000314 | F24D000316
专利权人/申请人 FUJIMOTO KK
摘要 (英语) PROBLEM TO BE SOLVED: To form structure having excellent quick heating properties and sound- insulating properties by simple easy execution at a low cost, to reform the structure of a floor-heated building floor at the low cost by mass-producing surface floor boards at an extremely low cost and to repair the structure of the building floor simply by extremely reducing the leakage of hot water. SOLUTION: The structure of the floor-heated building floor has a foundation floor 2, in which foundation boards 1 are arranged and fixed horizontally, wooden surface floor boards 3 laminated on the foundation floors 2 through a heat- insulating layer 5, and hot water pipes 4 heating the surface floor boards 3. The surface floor boards 3 have pipe grooves 6 having built-in hot water pipes 4. The pipe grooves 6 are opened and formed to the undersides of the surface floor boards 3, the hot water pipes 4 are introduced into the pipe grooves 6, and the surface floor boards 3 are laminated and fixed onto the top face of the heat-insulating layer 5. COPYRIGHT: (C)2000,JPO&Japio SUBJECT of the Invention And it constructs easily and also at low cost, and is made the structure excellent in rapid warming property and a sound-insulating property. The mass production of the surface floor board is extremely carried out to low cost, and it enables it to reform to low cost. A warm water leak is drastically reduced and it enables it to repair easily. PROBLEM to be solved The structure of the building floor|bed by which floor heating was carried out is with the underfloor 2 which puts the sheeting 1 in order horizontally and is fixed, The wooden surface floor board 3 laminated|stacked via the heat insulation layer 5 on this underfloor 2 and the warm water pipe 4 which heats the surface floor board 3 are provided. The surface floor board 3 has the pipe groove|channel 6 in which the warm water pipe 4 is incorporated. The pipe groove|channel 6 is opened and provided in the lower surface of the surface floor board 3, The warm water pipe 4 is put into this pipe groove|channel 6, and the surface floor board 3 is laminated|stacked on the upper surface of the heat insulation layer 5, and it is fixing. [MAT_IMAGE 000002]
摘要 - DWPI The floor has wooden surface floor boards (3) spread over a heat insulating layer (5) provided at the top surface of a foundation floor (2) made from a foundation board (1). Pipe grooves (6), which receive warm water pipes (4), are formed at the bottom surfaces of the wooden surface floor boards. For e.g. building. Simplifies and expedites construction of floor, at low cost. Offers sufficient sound and heat insulating performance. Allows remodeling of floor, at low cost. Simplifies repair of floor when warm water pipes leak. Ensures efficient heat transfer from warm water pipes to top surface of floor. Prevents heat transfer to underfloor. The figure shows the partial cross-sectional view of the floor.1Foundation board2Foundation floor3Wooden surface floor boards4Warm water pipes5Heat insulating layer6Pipe grooves
发明人 OBATA SETSUJIRO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1998
DWPI 同族专利成员 JP2000064579A | JP03182126B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200024
DWPI 同族专利国家/地区计数 1

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