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国外专利

FLOOR HEATING PANEL

  2014/11/19   浏览:605

[导读] Floor heating panel for wood flooring includes wooden fibre board interposed between substrate board and thin surface wood plate of laminated floor base board

公开号 JP9324923A
优先权号 JP199741408A
优先权日 1997-02-12
申请号 JP199741408A
申请日期 1997-02-12
公开日期 1997-12-16
IPC - 现版 E04F001518 | F24D001302
IPC - 现版 - DWPI F24D001302 | E04F001518
专利权人/申请人 NODA CORP
摘要 (英语) PROBLEM TO BE SOLVED: To provide a novel floor heating panel which manifests excellent effect for preventing cracking by drying of a woody surface thin plate and is excellent in strength and rigidity. SOLUTION: The present floor heating panel is adapted such that a floor base member 6 is laminated and united on the surface of a base plate 1 in which a surface shaped heater 2 is buried. In this case, the floor base member 6 is constructed by interposing a woody fiber plate 8 thinner than a substrate 7 between the substrate 7 and a woody surface thin plate 9 and laminating and uniting them, and the woody fiber plate 8 servers as a restriction member capable of preventing the influenece of expansion and contraction produced on a surface layer part of the substrate 7 following absorption and discharge of water content from being propagated to the woody surface thin plate 9. COPYRIGHT: (C)1997,JPO&Japio
摘要 - DWPI The panel includes a bed plate (1) on which a flat heating element (2) is embedded. A laminated floor base board (6) is fixed on the upper surface of the bed plate.The laminated floor base board consists of a wooden fibre board (8) which is interposed between a substrate board (7) and a thin surface wood plate (9). The wooden fibre board is made thinner than the substrate board. ADVANTAGEPrevents crack generation in laminated floor base board. Restrains expansion and shrinkage of substrate board due to moisture.
发明人 YUGAWA KIMIO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1997
DWPI 同族专利成员 JP9324923A | JP02995546B2
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 199809
DWPI 同族专利国家/地区计数 1

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