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WOOD FLOORING MATERIAL FOR HEATING FLOOR

  2014/11/19   浏览:547

[导读] Wood flooring material for heated floor has wood decorative veneer adhered to plywood base, with high boiling point solvent incorporated into flooring material by permeation to prevent bowing

公开号 JP4082706A
优先权号 JP1990197410A
优先权日 1990-07-25
申请号 JP1990197410A
申请日期 1990-07-25
公开日期 1992-03-16
IPC - 现版 B27K000334 | B27M000304 | E04F001504 | E04F001518
IPC - 现版 - DWPI B27K000334 | B27M000304 | E04F001504 | E04F001518
专利权人/申请人 MATSUSHITA ELECTRIC WORKS LTD
摘要 (英语) PURPOSE: To restrain shrinkage, thereby reduce dimensional change of a wood flooring material and prevent deformation such as bowing, by incorporating a high boiling point solvent having a boiling point higher than that of water into a wood flooring material. CONSTITUTION: A wood flooring material A is formed by adhering a wood decorative veneer 2 to a surface of a base 1 formed of plywood. A high boiling point solvent having a boiling point higher than that of water is incorporated in the flooring material A, particularly in the base 1, by permeation. The high boiling point solvent is preferably one which has a viscosity suitable for easy permeation into wood and which dissolves well in water, such as polyethylene glycol and ethylene glycol. To incorporate the high boiling point solvent in the wood flooring material A, logs of lauan or the like are first immersed in a boiling aqueous solution containing 5-50wt.% of the high boiling point solvent in water, and is boiled with the solution, followed by drying. COPYRIGHT: (C)1992,JPO&Japio
摘要 - DWPI The wood flooring material (A) is formed by adhering a wood decorative veneer (2) to a surface of a plywood base (1). A high boiling point solvent having a boiling point higher than that of water is incorporated in the flooring material, particularly in the base, by permeation. To incorporate the high boiling point solvent in the wood flooring material, logs of lauan or the like are first immersed in a boiling aqueous solution containing 5-50wt.% of the high boiling point solvent in water, and is boiled with the solution, followed by drying. Wood flooring material for heated floor. Incorporation of high boiling point solvent into flooring material reduces dimensional change of a flooring material and prevents deformation such as bowing. Preferred Solvent: The high boiling point solvent is preferably one having a viscosity suitable for easy permeation into wood and which dissolves well in water, such as polyethylene glycol and ethylene glycol. The drawing shows a side view of the flooring material.1base2wood decorative veneerAwood flooring material
发明人 KAWABATA SHIGETO | HAYASHI MORIO
申请国家/地区 JP
优先权国家/地区 JP
优先权年 1990
DWPI 同族专利成员 JP02731287B2 | JP4082706A
DWPI 同族专利成员计数 2
公开语言 JA
DWPI 更新 200929
DWPI 同族专利国家/地区计数 1

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